卷曲硅三维芯片可缩小电路尺寸
IEEE Spectrum报道称，研究人员正在开发一种名为"卷曲硅"的新型三维芯片制造技术。该技术通过将硅晶圆卷曲成紧凑的三维结构，有望大幅缩小电子电路的物理尺寸，同时保持或提升性能。这种方法不同于传统的平面芯片堆叠，可能为更小、更高效的电子设备开辟新路径。
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